Our vision is to transform how the world uses information to enrich life forall.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR42535 DIRECTOR, TEST ENGINEERINGAs Test Engineering Director, you will be held full accountability to successfully improve all engineering metric – RMA, quality deviation, in-line QDR, yield, reduce hold lot quantity, reduce hold lot release duration, machine uptime, unscheduled downtime/schedule downtime, OEE, develop/deploy value engineering projects to improve cycle time, improve manufacturability, reduce capital spending as well as successful NPI execution to hit 100% OTD etc.You will need to supervise entire engineering execution, improve engineering competency & field to relentlessly use data to drive solution. You will be expected to demonstrate proactive, forward-looking capability to have resource & competency ready ahead of time to support site execution to business plan including NPI & HVM sustaining and great communication with central engineering, global quality as well as network other engineering directors to make sure your site's improvement never fall behind.You will need to demonstrate good people skill to build & strengthen engineering team's engagement, enable engineering team with needed resource & tools & skill & timely recognition to help them implement to target successfully. You will also expected to have tough decision to handle underperformer in timely fashion.Responsibilities and TasksImprove engineering metric:Improve OEE thru reduction of unscheduled downtime, optimize schedule downtime and improve tool availability, be able to dig out/deploy solution to resolve any hidden loss.Reduce quality deviation thru timely detection within current process step, current wafer/die/strip level and reduce the occurrence of deviation by deployment of FDC, ADC, SMAI initiatives.Improve assembly yield to meet BIC target for all die stacking.Reduce hold lot occurrence a reduce hold lot release duration.Hit NPI CT BIC performance and Hit NPI OTD 95%+Support capital reduction thru value engineering project in CT & VSM activities.Manage Area Personnel and ProgramsSupervise and hold Team Members accountable for consistent performance standardsUse the ET program to understand and monitor area efficiencyManage staffing, MPP, equipment status, awareness of future build schedules and equipment capacitiesMakes decisions that directly impact the achievement of work unit and sub-function objectivesSets objectives for the performance of team member. Provides guidance to the team member and advises on issues related to sub-functionBegins working on career development responsibilities for direct reports and adapts communication style to engage and empower team memberManage QualityHandle quality improvement programs in respective areasQDR follow-upsIdentify trends on shift as well as Interaction Team areasSolve ProblemsBe aware of legal policiesUse corporate resources including HR, legal, and health servicesBe proactive to avert avoidable problemsUse effective problem-solving skills and Applies broad knowledge to solve problems and handle conflict within areaCommunicate issues with other managers while being sensitive to confidentialityDemonstrate InitiativeSeek out issues, projects, or tasksPerform tasks and assignments without being remindedDo what is required to achieve a positive resultExplore new insightsAccept responsibility, be accountable, and follow through with commitmentsLead and handle area changesEnsure a Safe and Compliant Work EnvironmentReview TRAIN profiles or TRAIN reports to ensure team members are properly trainedPerform work area inspections to identify, anticipate and promptly correct hazardsObserve team member work and consistently implement procedures and work rulesConduct timely event investigations using root cause analysis techniquesEncourage hazard identification and safe work practices by giving periodic workplace safety talks and rewarding earned safety accomplishmentsEducation RequiredBachelor's or Master's degree in Computer Science or Engineering.Experience Desired10+proven experience in Semiconductor assembly packaging engineering equipment or process engineering.QualificationsIndependent and highly motivated with good communication and interpersonal skillsAble to adapt to changes in an exciting and dynamic environmentAbout Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations,please ****** Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
