Package Designer

The India System design team is responsible to own and deliver System design milestones for IBM POWER and mainframe platforms. The team collaborates with Global System design & development teams and stakeholders. As a Semiconductor Packaging designer, it involves designing laminate products, laminate test vehicles, and the test cards and silicon test sites used to validate the packaging technology.ResponsibilitiesAs Package Designer, the responsibilities includeLay out the signals and power delivery structures using the design tools.Post design completion,  perform checks to ensure an error-free package design, including DFM (Design For Manufacturing), aiming for a high laminate yield in manufacturing.Design checks that encompass both manufacturing and electrical aspects, necessitating a strong understanding of ground rules and electrical parameters.Close communication with the customer for design inputs, team members in the design process, and suppliers for design for manufacturability.